A zero-thermal-expansion composite with enhanced thermal and electrical conductivities resulting from 3D interpenetrating copper network

Buke Dong, Xinge Guo, Peng Tong, Lulu Xie, Keke Liu, Tingjiao Xiong, Xiaoguang Zhu, Jianchao Lin, Wenhai Song, Yuping Sun

Journal of Alloys and Compounds · 2024 · 12 citations · 40 references

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