Concepedia

Publication | Closed Access

Ultrahigh strength, thermal stability and high thermal conductivity in hierarchical nanostructured Cu-W alloy

DOI

68

Citations

79

References

2023

Year

Junsheng Ke, Rui Liu, Z.M. Xie, Linchao Zhang, X.P. Wang, Q.F. Fang, C.S. Liu, Xuebang Wu
Acta Materialia

References

YearCitations

Page 1