Simplicity is the ultimate sophistication: One-step forming for thermosensitive solid–solid phase change thermal energy harvesting, storage, and utilization

Abstract

• Simplified synthesis strategy for thermally cured self-supported phase change materials . • Transformation from solid-liquid to solid–solid for precise molding. • No curing agents or solvents, no pollution emissions. • Excellent environmental E-factor and nearly 100% product conversion rate. • High value in ancient thermotherapy and advanced chip cooling. In light of the growing recognition of low-carbon initiatives, renewable energy is gradually assuming a dominant role within the energy framework. Phase change materials can enhance the efficiency of renewable energy utilization by energy peak shaving and time shifting. However, leakage and inherent rigidity signify that a significant amount of energy input is required for scale-up applications of phase change materials to enhance shape stability and processability during industrial installation. In conventional enhancement strategies, high-quality encapsulation means more intricate processes and higher energy consumption. Here we propose a simplified thermally-initiated encapsulation and molding strategy, which involves grafting the phase change materials onto thermosetting polymer backbones by covalently integrated, to construct self-supported phase change materials with complex three-dimensional geometry. The encapsulation process is macroscopically manifested as a transformation from solid-liquid to solid–solid phase change. Therefore, by imposing restrictions on liquid materials, any ultra-high-precision complex structure can be molded, and mechanical properties are imparted through curing to achieve shape stability, ultimately enables the integration of phase change material encapsulation and casting. The complete process requires no curing agents or organic solvents, and no pollution emissions, making it highly maneuverable and environmentally friendly. Furthermore, we demonstrate the universal high value applications of new materials in different fields. In the ancient thermotherapy experiment, the sample exhibited sustained heat release for 8 min. In the advanced chip cooling simulation, the chip exhibits superior heat dissipation performance, as evidenced by its operating temperature being 50 °C lower than that of natural cooling within 20 min. It confirms the remarkable potential of phase change materials constructed through this approach for thermal energy applications.