Publication | Closed Access
Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition
27
Citations
48
References
2023
Year
Materials ScienceMaterials EngineeringElectrical EngineeringFriction WeldingCurrent-induced Solder EvolutionEngineeringMechanical EngineeringSn-3.0ag-0.5cu Solder JointsElectronic PackagingMicrostructure
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