Publication | Closed Access

A novel integrated flat thermosyphon heat sink for energy-efficient chip-level thermal management in data centers

Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Energy EfficiencyData Center SystemThermal ManagementComputer EngineeringComputer ArchitectureGreen Data CenterData CentersThermodynamicsElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringDatacenter-scale ComputingRefrigeration