Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling

An internal variable constitutive model for hot working of metals

Stuart C. Brown, K KIM, Lallit Anand · International Journal of Plasticity · 1989 · 763 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Study and Handling Methods of Power IGBT Module Failures in Power Electronic Converter Systems

Ui‐Min Choi, Frede Blaabjerg, Kyo‐Beum Lee · IEEE Transactions on Power Electronics · 2014 · 671 citations

Engineering, Electrical Engineering, Fault-tolerant Systems +16

Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures

Lallit Anand · Journal of Engineering Materials and Technology · 1982 · 542 citations

Natural Sciences, Materials Engineering, Materials Science +17

From classical thermodynamics to phase-field method

Long‐Qing Chen, Yuhong Zhao · Progress in Materials Science · 2021 · 393 citations · Full text

Natural Sciences, Mathematics, Physics +14

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

John G. Bai, Ziyang Zhang, Jesus N. Calata et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 370 citations

Engineering, Materials Engineering, Materials Science +17