Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling - Concepedia

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Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling

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Citations

32

References

2023

Year

Xiaoguang Huang, Yichao Wang, Qihui Zhu, Zhongzhe Du, Longchi Zhou, Hehe Liu

Engineering Failure Analysis

Electrical EngineeringPower CyclingEngineeringHardware ReliabilityPower DeviceThermal CreepApplied PhysicsElectronic PackagingSilver Solder

References

	Year	Citations

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