IEEE Open Journal of Power Electronics · 2023 · 59 citations · 122 references
EngineeringElectrical EngineeringEnergy SystemsPower ElectronicsRenewable Energy IntegrationConverter TopologiesDc-dc ConvertersElectromagnetic CompatibilityMultilevel ConvertersPower Electronics For Renewable EnergyPower SystemsConverter Modulation TechniquesConvertersElectromagnetic InterferenceElectromagnetic Interference MitigationElectromagnetic Interference ReductionModulation TechniquesPower ConversionPower Conversion Systems
Multilevel converters (MLCs) are widely recognized for their exceptional benefits and have emerged as the preferred choice for medium- and high-power/voltage applications. Their usage has also been extended to low-power applications to overcome issues associated with high switching frequencies and electromagnetic interference (EMI) commonly encountered in two-level converters. Common dc-link MLCs have received particular attention in industry due to their ability to eliminate the need for bulky and inefficient transformers and rectifiers, making them a compelling option for different applications, primarily medium- and high-power/voltage applications such as wind turbine (WT) power conversion systems. Furthermore, common dc-link topologies are required for back-to-back (BTB) configurations, as they facilitate the use of a shared dc-link between the rectification and inversion stages. Despite their popularity, there is currently no comprehensive review article dedicated to common dc-link topologies. This paper addresses this gap by presenting a comprehensive review of common dc-link MLCs, covering their topological evolution, features, topologies comparison, modulation techniques, control strategies, and industrial application areas. Additionally, future perspectives and recommendations are discussed to provide researchers and engineers with a better understanding of the potential applications and advantages of these converters.
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A Survey on Cascaded Multilevel Inverters
Mariusz Malinowski, K. Gopakumar, José Rodríguez et al. · IEEE Transactions on Industrial Electronics · 2009 · 2.3K citations