Effect of Electrodeposition Parameters on the Morphology of Three-Dimensional Porous Copper Foams

Abstract

Copper films with different open interconnected porous structures were gained by using hydrogen bubbles as dynamic template at different electrodeposition conditions (deposition current density and deposition temperature). The influences of electrodepositing parameters on the micro-morphology and grain size were investigated. The experimental results showed that the morphology of copper foams changed from distributed sparse dendrites to honeycomb-like structure with increasing the deposition current density, further increased the current density could lead to the grain refinement and lattice parameter reduction. Relatively lower temperature could contribute to the formation of three-dimensionally ordered porous structures and the stability of the lattice regularity. At room temperature, the porous network was observed on the surface of the Cu substrate, while it is difficult to form ordered morphology at higher bath temperature (≥40°C). Meanwhile, the grain size and lattice constant increased obviously with increasing the deposition temperature, implying the existence of lattice distortion for high temperature deposition.