Publication | Closed Access
Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding
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Citations
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References
2023
Year
Materials ScienceMaterials EngineeringGrowth OrientationsEngineeringFriction WeldingMechanical EngineeringApplied PhysicsThermal Gradient BondingMetallurgical InteractionShear PerformanceAlloy DesignElectronic PackagingMicrostructureMetal Processing
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