A micromechanical damage-healing model for encapsulation-based self-healing polymer composites under tensile loading

Abstract

In this study, a novel micromechanics-based damage model is proposed for the damage evolution of a two-component microencapsulated-based self-healing polymer composite. In this way, a representative volume element (RVE) including an epoxy matrix with randomly distributed poly(methyl methacrylate) (PMMA) microcapsules is modeled in DigimatTM software and analyzed in Abaqus®. A new technique is developed to investigate the progressive damage by pre-inserted cohesive elements along all element boundaries of the epoxy matrix, PMMA shell, and capsule-matrix interfaces with the bilinear traction–separation law. Moreover, the impact of interface bonding strength, interface fracture energy, and PMMA microcapsules volume fraction on the load-carrying capacity of the RVEs under uniaxial tension loading was studied. The results indicated that the tensile strength of the self-healing polymer composite increased as the interfacial strength and fracture energy increased from 10 to 60 MPa and 100 to 1000 J/m2, respectively. Furthermore, the higher volume fraction of 5% PMMA microcapsules results in a lower load-carrying capacity of self-healing polymer composite with a strength of 4.9 N. A similar trend of Young’s modulus was observed for microcapsule-loaded epoxy composite compared to the pristine epoxy matrix. The micromechanical model has proper accuracy in predicting the tension behavior of self-healing composite in comparison to experimental results. Finally, two healing strategies are considered for the damaged RVE.