Research Progress of Electroplated Micropore for Interconnection Technology

Abstract

Abstract Electroplated micropore interconnection is one of the core technologies to realize the electronic connections of the high-density multilayer Printed circuit board (PCB). The quality of electroplated copper layer is a key factor for the reliability of PCB and electronic components. Focusing on the acid copper plating process, this paper expounds the development of the electroplating solution and additives, the mechanisms of electroplated copper deposition and hole filling mechanism, and the process control of electroplating, which will provide a reference for the in-depth study of the electroplating micropore interconnection technology.