Publication | Closed Access
Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity
28
Citations
22
References
2023
Year
Materials ScienceMaterials EngineeringDiamond-like CarbonEngineeringApplied PhysicsInterface Formation EvolutionThermal ConductionHot-forged Copper-Thermal ConductivityThermal Property
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