CALPHAD-guided alloy design of Sn–In based solder joints with multiphase structure and their mechanical properties

Recent progress on the development of Sn–Bi based low-temperature Pb-free solders

Fengjiang Wang, Hong Chen, Ying Huang et al. · Journal of Materials Science Materials in Electronics · 2019 · 207 citations

Engineering, Materials Engineering, Materials Science +11

Database for Solder Properties with Emphasis on New Lead-free Solders

David R. Smith, Thomas A. Siewert, L Stephen et al. · 2002 · 178 citations

Natural Sciences, Materials Engineering, Materials Science +8

Strain partitioning in dual-phase steels containing tempered martensite

Qihang Han, Alireza Asgari, Peter Hodgson et al. · Materials Science and Engineering A · 2014 · 105 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +12

Hybrid nanostructured aluminum alloy with super-high strength

Zhi Wang, Rui Qu, S. Scudino et al. · NPG Asia Materials · 2015 · 102 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy

Aaron D. LaLonde, D. Emelander, J. Jeannette et al. · Journal of Electronic Materials · 2004 · 66 citations

Natural Sciences, Materials Engineering, Materials Science +15