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Mechanistic difference between Si-face and C-face polishing of 4H–SiC substrates in aqueous and non-aqueous slurries

Materials ScienceC-face PolishingNon-aqueous SlurriesEngineeringMaterial ProcessingSurface ScienceApplied PhysicsSurface EngineeringSurface TreatmentMechanistic DifferenceSurface ProcessingMicrostructure