Investigation on out-of-plane displacement measurements of thin films via a mechanical constraint-based 3D-DIC technique - Concepedia

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Investigation on out-of-plane displacement measurements of thin films via a mechanical constraint-based 3D-DIC technique

13

Citations

24

References

2022

Year

Lu Wang, Guangyan Liu, Yawen Deng, Wenzhang Sun, Qinwei Ma, Shaopeng Ma

Optics Communications

EngineeringMechanicsMechanical EngineeringApplied PhysicsSolid MechanicsMechanics Of MaterialsThin FilmsOut-of-plane Displacement MeasurementsPhotoelasticity3D PrintingThin Film Processing

References

	Year	Citations

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