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Wafer-scale solution-processed 2D material analog resistive memory array for memory-based computing

204

Citations

50

References

2022

Year

Abstract

Realization of high-density and reliable resistive random access memories based on two-dimensional semiconductors is crucial toward their development in next-generation information storage and neuromorphic computing. Here, wafer-scale integration of solution-processed two-dimensional MoS<sub>2</sub> memristor arrays are reported. The MoS<sub>2</sub> memristors achieve excellent endurance, long memory retention, low device variations, and high analog on/off ratio with linear conductance update characteristics. The two-dimensional nanosheets appear to enable a unique way to modulate switching characteristics through the inter-flake sulfur vacancies diffusion, which can be controlled by the flake size distribution. Furthermore, the MNIST handwritten digits recognition shows that the MoS<sub>2</sub> memristors can operate with a high accuracy of >98.02%, which demonstrates its feasibility for future analog memory applications. Finally, a monolithic three-dimensional memory cube has been demonstrated by stacking the two-dimensional MoS<sub>2</sub> layers, paving the way for the implementation of two memristor into high-density neuromorphic computing system.

References

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