Bonding wire loop antenna built into standard BGA package for 60 GHz short-range wireless communication

Abstract

Summary form only given, as follows. We propose a bonding wire antenna built into a BGA package for 60 GHz short-range wireless communication. This antenna utilizes two bonding wires and a metal plate on an interposer in a BGA package and has a loop shape. It is built into a standard BGA package without special modification, so that it can be fabricated at low cost by conventional BGA package-fabrication processes. The first and unique evaluation of the antenna fully sealed by encapsulation resin was done by measurement.