Publication | Closed Access
High-efficiency cooling via the monolithic integration of copper on electronic devices
80
Citations
33
References
2022
Year
Electrical EngineeringElectronic DevicesEngineeringAdvanced Packaging (Semiconductors)Liquid Metal CoolingHeat ExchangerApplied PhysicsThermal ManagementComputer EngineeringHigh-efficiency CoolingMonolithic IntegrationElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringRefrigeration
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