Publication | Open Access
Ultrafast laser welding of ceramics
202
Citations
34
References
2019
Year
Optical MaterialsEngineeringCeramics Integral ComponentsLaser MaterialLaser WeldingLaser OpticsWelding ProcessOptical PropertiesLaser ManufacturingUltrafast Laser WeldingUltrafast LasersMaterials SciencePhotonicsLaser Processing TechnologyOptical CeramicLaser-assisted DepositionMicrostructureAdvanced Laser ProcessingModern ManufacturingApplied PhysicsOptoelectronics
Welding of ceramics is a key missing component in modern manufacturing, yet current methods cannot join ceramics near temperature‑sensitive materials such as polymers and electronic components. The study introduces an ultrafast pulsed laser welding approach that focuses light on ceramic interfaces to induce localized melting via nonlinear absorption, avoiding ablation. The method relies on the interplay between linear and nonlinear optical properties and laser energy‑material coupling to create a localized melting zone. The welded assemblies withstand high vacuum and exhibit shear strengths comparable to metal‑to‑ceramic diffusion bonds, enabling ceramics to serve as integral components in harsh‑environment devices and optoelectronic/electronic packages requiring visible‑radio frequency transparency.
Welding of ceramics is a key missing component in modern manufacturing. Current methods cannot join ceramics in proximity to temperature-sensitive materials like polymers and electronic components. We introduce an ultrafast pulsed laser welding approach that relies on focusing light on interfaces to ensure an optical interaction volume in ceramics to stimulate nonlinear absorption processes, causing localized melting rather than ablation. The key is the interplay between linear and nonlinear optical properties and laser energy-material coupling. The welded ceramic assemblies hold high vacuum and have shear strengths comparable to metal-to-ceramic diffusion bonds. Laser welding can make ceramics integral components in devices for harsh environments as well as in optoelectronic and/or electronic packages needing visible-radio frequency transparency.
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