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Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package

Materials SciencePolymer MaterialEngineeringPolymer SciencePolymer EngineeringBiomedical EngineeringTemporary BondingElectronic PackagingUv AbsorptionThermoplastic CompositeOrganosoluble Thermoplastic PolyimidePolymer Chemistry