Origin and evolution of a crack in silicon induced by a single grain grinding - Concepedia

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Origin and evolution of a crack in silicon induced by a single grain grinding

67

Citations

45

References

2022

Year

Zhenyu Zhang, Xin Wang, Fanning Meng, Dongdong Liu, Siling Huang, Junfeng Cui, Jianmei Wang, Wei Wen

Journal of Manufacturing Processes

EngineeringPhysicsMechanicsSilicon DebuggingMechanical EngineeringSolid MechanicsDefect FormationCrack FormationDynamic Crack PropagationMechanics Of MaterialsMicrostructureSingle Grain Grinding

References

	Year	Citations

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