Nano-Micro Letters · 2021 · 212 citations · 60 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsFunctional MaterialsHeat TransferComposite MaterialsConductive PolymersGraphene NanomaterialsNanocompositesPolymer CompositesThermal Protection MaterialsElectromagnetic InterferenceElectromagnetic Interference MitigationElectromagnetic Interference ReductionGraphene OxideGraphene-based MaterialsThermal ConductivityThermal Conductivity EnhancementThermally Conductive Composites
Abstract The development of lightweight and integration for electronics requires flexible films with high thermal conductivity and electromagnetic interference (EMI) shielding to overcome heat accumulation and electromagnetic radiation pollution. Herein, the hierarchical design and assembly strategy was adopted to fabricate hierarchically multifunctional polyimide composite films, with graphene oxide/expanded graphite (GO/EG) as the top thermally conductive and EMI shielding layer, Fe 3 O 4 /polyimide (Fe 3 O 4 /PI) as the middle EMI shielding enhancement layer and electrospun PI fibers as the substrate layer for mechanical improvement. PI composite films with 61.0 wt% of GO/EG and 23.8 wt% of Fe 3 O 4 /PI exhibits high in-plane thermal conductivity coefficient (95.40 W (m K) −1 ), excellent EMI shielding effectiveness (34.0 dB), good tensile strength (93.6 MPa) and fast electric-heating response (5 s). The test in the central processing unit verifies PI composite films present broad application prospects in electronics fields.
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Liu‐Xin Liu, Wei Chen, Haobin Zhang et al. · Advanced Functional Materials · 2019 · 697 citations
Natural Sciences, Materials Engineering, Materials Science +17
Ping Song, Bei Liu, Chaobo Liang et al. · Nano-Micro Letters · 2021 · 691 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +16