Joining of Si3N4/Si3N4 with CuNiTiB paste brazing filler metals and interfacial reactions of the joints

Model predictions for the enthalpy of formation of transition metal alloys

A.R. Miedema, F.R. de Boer, R. Boom · Calphad · 1977 · 1.2K citations

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The wetting and bonding of diamonds by copper-base binary alloys

P.M. Scott, M. G. Nicholas, B. Dewar · Journal of Materials Science · 1975 · 109 citations

Natural Sciences, Materials Engineering, Materials Science +7

Bonding Mechanisms in Silicon Nitride Brazing

Ronald E. Loehman, Antoni P. Tomsia, Joseph A. Pask et al. · Journal of the American Ceramic Society · 1990 · 79 citations

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Joining of Si3N4 using Ag57Cu38Ti5 brazing filler metal

A. P. Xian, Z. -Y. · Journal of Materials Science · 1990 · 36 citations

Engineering, Materials Engineering, Materials Science +10

The wetting, reaction and bonding of silicon nitride by Cu-Ti alloys

DH Kim, Sung Hoon Hwang, Sung-Chul Chun · Journal of Materials Science · 1991 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +11