Publication | Open Access

Towards the thermal management of electronic devices: A parametric investigation of finned heat sink filled with PCM

Electrical EngineeringEngineeringEnergy EfficiencyHeat ExchangerThermal ManagementFinned Heat SinkThermal AnalysisThermodynamicsThermal ModelingElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringHeat PipeParametric Investigation