High thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration

Eunsung Lee, Jong-Gu Kang, Min-Kyeong Kang, Ki‐Hong Kim, Seontae Park, Yong Su Kim, In Kim, Sung‐Dug Kim, Jin‐Young Bae

Composites Part B Engineering · 2021 · 52 citations · 39 references

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