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An efficient localized Trefftz-based collocation scheme for heat conduction analysis in two kinds of heterogeneous materials under temperature loading

Numerical AnalysisMaterials ScienceEngineeringTemperature LoadingThermal TransportNumerical SimulationTransport PhenomenaHeterogeneous MaterialsThermal AnalysisThermodynamicsThermal ConductionHeat TransferHeat Conduction AnalysisThermal EngineeringThermal ConductivityThermal PropertyMultiscale Modeling