Poly(ionic liquid)s Containing Alkoxy Chains and Bis(trifluoromethanesulfonyl)imide Anions as Highly Adhesive Materials

Abstract

Abstract Adhesive materials have wide applications in diverse fields, but the development of a novel and multipurpose adhesive is a great challenge. This study demonstrates that conventional poly(ionic liquid)s (PILs) can be designed as highly efficient adhesives by simply introducing alkoxy moieties into the cationic backbone of PILs containing bis(trifluoromethanesulfonimide) (TFSI − ) anions. The incorporated flexible alkoxy chain not only reduces the glass transition temperature of PILs but also endows these materials with strong hydrogen bonding interactions, which, together with the unique electrostatic interaction of the PILs, simultaneously contributes to a high cohesive energy and interfacial adhesive energy. Consequently, these alkoxy PILs are highly adhesive on various substrates such as glass, ceramic, stainless steel, aluminum, and polymers, in contrast to the nonadhesive behavior of conventional PILs. Photosensitive or electronically conductive composite adhesives are fabricated by virtue of the compatibility between ionic liquids and carbon nanotubes or silver nanofibers. Interestingly, the PIL‐2‐TFSI adhesive possesses a unique and reversible response to electric fields and achieves up to 35% improvement in adhesive strength.