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Surface-enhanced copper bonding wire for LSI and its bond reliability under humid environment
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2009
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Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringCorrosionSurface ScienceApplied PhysicsHumid EnvironmentBond ReliabilityElectronic PackagingMicroelectronicsCladding (Metalworking)Interconnect (Integrated Circuits)Electrical Insulation
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