Concepedia

Publication | Closed Access

Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

DOI

127

Citations

34

References

2021

Year

Yang Hu, Chao Chen, Yingfeng Wen, Zhigang Xue, Xingping Zhou, Dean Shi, Guo‐Hua Hu, Xiaolin Xie
Composites Science and Technology

References

YearCitations

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