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High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

Materials EngineeringMaterials ScienceEngineeringMechanical EngineeringPolymer ScienceEpoxy-based Molding CompoundMolded Electronic PackageHigh-performance MaterialElectronic PackagingThermoplastic CompositeHigh TemperatureMolding (Process)