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Enhancement of bonding strength in BiTe-based thermoelectric modules by electroless nickel, electroless palladium, and immersion gold surface modification

Materials ScienceMaterials EngineeringEngineeringSurface ScienceApplied PhysicsElectroless NickelThermoelectricsElectroless PalladiumThermoelectric MaterialHigh-performance MaterialBite-based Thermoelectric ModulesThermal ConductionElectronic PackagingThermal ConductivityThermal PropertyElectrical Insulation