Publication | Closed Access
Diffusion bonding of copper to titanium using CoCrFeMnNi high-entropy alloy interlayer
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Citations
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References
2020
Year
Materials ScienceMaterials EngineeringEngineeringCorrosionDiffusion BondingSurface ScienceApplied PhysicsAlloy DesignMetallurgical InteractionAlloy PhaseMultiprincipal Element AlloyMicrostructureCladding (Metalworking)
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