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A novel strategy to electrodeposit high-quality copper foils using composite additive and pulse superimposed on direct current

Materials ScienceElectroactive MaterialElectrical EngineeringEngineeringNovel StrategyElectrode-electrolyte InterfaceHigh-quality Copper FoilsElectrochemical CellElectrochemical ProcessElectrochemistryElectrical Insulation