Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering - Concepedia

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Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering

25

Citations

35

References

2020

Year

B. Jayachandran, B. Prasanth, R. Gopalan, Titas Dasgupta, D. Sivaprahasam

Materials Research Bulletin

Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringApplied PhysicsThermoelectricsThermoelectric MaterialSs 304Thermal ConductionThermal ConductivityThermal Property

References

	Year	Citations

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