Tailoring the thermoelectric and structural properties of Cu–Sn based thiospinel compounds [CuM_1+xSn_1−xS₄ (M = Ti, V, Cr, Co)]

Abstract

The thermoelectric properties of a series of Cu–Sn based thiospinel compounds by screening a variety of transition elements (M = Ti, V, Cr, Co) as a potential substituent at the Sn-site (both p- and n-type thiospionels) are reported and discussed.