Publication | Closed Access

Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface

Materials EngineeringMaterials ScienceDiamond-like CarbonNano-diamond/copper Composite PlatingsEngineeringNanomaterialsNanotechnologySurface ScienceApplied PhysicsInterfacial AdhesionNanofabricationDiamond Surface