Experimental study of <scp>PLA</scp> thermal behavior during fused filament fabrication

Abstract

Abstract Fused filament fabrication (FFF) is an additive manufacturing technique that is used to produce prototypes and a gradually more important processing route to obtain final products. Due to the layer‐by‐layer deposition mechanism involved, bonding between adjacent layers is controlled by the thermal energy of the material being printed, which strongly depends on the temperature development of the filaments during the deposition sequence. This study reports experimental measurements of filament temperature during deposition. These temperature profiles were compared to the predictions made by a previously developed model. The two sets of data showed good agreement, particularly concerning the occurrence of reheating peaks when new filaments are deposited onto previously deposited ones. The developed experimental technique is shown to demonstrate its sensitivity to changing operating conditions, namely platform temperature and deposition velocity. The data generated can be valuable to predict more accurately the bond quality achieved in FFF parts.