The curing kinetics and mechanical properties of epoxy resin composites reinforced by PEEK microparticles - Concepedia

Concepedia

Publication | Closed Access

The curing kinetics and mechanical properties of epoxy resin composites reinforced by PEEK microparticles

81

Citations

39

References

2020

Year

Ting Zheng, Hang Xi, Zixuan Wang, Xiaohong Zhang, Yuan Wang, Yingjie Qiao, Peng Wang, Qiuwu Li, Zhuona Li, Cheng Ji,

Polymer Testing

Materials ScienceReinforcement MaterialCuring KineticsEngineeringMechanical PropertiesMechanical EngineeringPolymer ScienceComposite TechnologyPeek MicroparticlesEpoxy Resin CompositesThermoplastic CompositeNanocomposite

References

	Year	Citations

Page 1

Page 1