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Calculated thermally induced stresses in adhesively bonded and soldered assemblies.
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1986
Year
Unknown Venue
Materials ScienceEngineeringMechanicsAdhesive MaterialMechanical EngineeringThermal AnalysisElectronic PackagingThermomechanical AnalysisThermal EngineeringThermomechanical ProcessingMechanics Of MaterialsInduced StressesStructural Adhesive
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