Publication | Closed Access
Using acoustic emissions (AE) to monitor mode I crack growth in bonded joints
55
Citations
30
References
2019
Year
Damage MechanismStructural IntegrityEngineeringNondestructive TestingMechanical EngineeringAcoustic EmissionsStructural Health MonitoringBonded JointsCrack FormationStructural MechanicsDynamic Crack PropagationMechanics Of MaterialsFracture Mechanics
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