Publication | Closed Access
Structural, electronic, and elastic properties of orthorhombic, hexagonal, and cubic Cu3Sn intermetallic compounds in Sn–Cu lead-free solder
82
Citations
66
References
2019
Year
Materials EngineeringMaterials ScienceEngineeringSn–cu Lead-free SolderMetallic Functional MaterialApplied PhysicsMetallurgical InteractionSolid-state ChemistryElastic Properties
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