Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Abstract

Abstract Ultraviolet light-emitting diodes (UV-LEDs) have drawn considerable attention in environment, life science, and industry fields, such as the applications of near UV-LEDs in resin curing, illumination, and identification, and deep UV-LEDs in disinfection, medical treatment, and biochemical inspection. However, due to the limitation of packaging technology, UV-LED devices exhibit low light efficiency and poor reliability compared with visible LEDs. The organic encapsulation materials are prone to UV aging, thermal degradation, and nonairtightness, which significantly reduce the performances of UV-LEDs. In order to solve this issue, UV-LED packaging technology has been proposed for UV-LED devices instead of conventional LED packaging. In this review, we investigated in detail the overview and challenges of near-ultraviolet light-emitting diodes (NUV-LED)/deep-ultraviolet light-emitting diodes (DUV-LED) packaging. For the packaging of UV-LEDs, all inorganic encapsulation materials, hermetic packaging structures with low-temperature bonding, reduced reflection losses, UV stable and transparent materials, and effective thermal management are key progresses to enhance the light efficiency and reliability of UV-LEDs. In addition, the summary and perspectives of NUV-LED/DUV-LED packaging were introduced and discussed.