Publication | Closed Access
Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction
93
Citations
49
References
2019
Year
Materials ScienceElectrical EngineeringEngineeringMulti-functional CompositeComposite TechnologyEmi ShieldingHigh-performance MaterialThermal ConductionElectronic PackagingThermal ConductivityElectrical InsulationLow Percolation 3D
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