Superhydrophobic and Low‐<i>k</i> Polyimide Film with Porous Interior Structure and Hierarchical Surface Morphology

Fuping Dong, Hongwei Li, Liangyu Lu, Yuzhu Xiong, Chang‐Sik Ha

Macromolecular Materials and Engineering · 2019 · 20 citations · 27 references

Concepts

Abstract

Abstract Porous interior structured polyimide (PI) films with a hierarchical surface are fabricated from 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride and 4,4′‐oxydianiline by a water vapor induced phase separation process under a humid environment. Superhydrophobic properties with a water contact angle of 161° are obtained using the hierarchical surface morphology, which can be adjusted from flower‐like to wrinkle‐shape particles facilely by changing the relative humidity. The dielectric constant ( k ) of the PI film decreases sharply from 2.8 (film prepared under dry conditions) to ≈1.9 (film prepared under humid conditions) because of the interior porous structure and fluorine‐containing framework. Both a low‐ k and superhydrophobicity are very important parameters for PI films in microelectronic and insulating applications.

References

27