Publication | Closed Access
Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints
78
Citations
33
References
2019
Year
Materials ScienceMaterials EngineeringFriction WeldingEngineeringCorrosionMechanical EngineeringMetallurgical InteractionCu/sn58bi/cu TlpSolder JointsElectronic PackagingCuznal Particles AdditionMicrostructureMetal Processing
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