Effects of debinding process on properties of sintered AlN substrate

Pore‐Grain Boundary Interactions and Grain Growth

R. J. Brook · Journal of the American Ceramic Society · 1969 · 366 citations

Engineering, Materials Engineering, Materials Science +14

Development and Microstructural Characterization of High‐Thermal‐Conductivity Aluminum Nitride Ceramics

Yasuhiro Kurokawa, Kazuaki Utsumi, H. Takamizawa · Journal of the American Ceramic Society · 1988 · 181 citations

Natural Sciences, Materials Engineering, Materials Science +17

BINDER REMOVAL FROM CERAMICS

Jennifer A. Lewis · Annual Review of Materials Science · 1997 · 164 citations

Natural Sciences, Materials Engineering, Materials Science +16

Development of High Thermal Conductivity Aluminum Nitride Ceramic

Ran‐Rong Lee · Journal of the American Ceramic Society · 1991 · 114 citations

Natural Sciences, Materials Engineering, Materials Science +15

Effect of Additives on the Pressureless Sintering of Aluminum Nitride between 1500° and 1800°C

Thomas B. Troczynski, Patrick S. Nicholson · Journal of the American Ceramic Society · 1989 · 89 citations

Natural Sciences, Materials Engineering, Materials Science +17