Publication | Open Access
Ru passivated and Ru doped ε-TaN surfaces as a combined barrier and liner material for copper interconnects: a first principles study
22
Citations
44
References
2019
Year
Materials ScienceSurface CharacterizationLiner MaterialSemiconductor TechnologyEngineeringCu AdatomsFirst PrinciplesSurface ScienceApplied Physicsε-Tan SurfacesLiner PropertiesSurface AnalysisSurface EngineeringSemiconductor MaterialElectronic PackagingPotential BarrierInterface PropertyInterconnect (Integrated Circuits)
A study of Cu adatoms on Ru passivated and Ru doped ε-TaN to highlight their potential barrier and liner properties for copper interconnects.
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