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Investigation on the interfacial stability of multilayered Cu–W films at elevated deposition temperatures during co-sputtering

Materials ScienceMaterial AnalysisEngineeringSurface ScienceApplied PhysicsInterfacial StabilityElevated Deposition TemperaturesThin Film Process TechnologyThin FilmsChemical DepositionChemical Vapor DepositionMultilayered Cu–w FilmsThin Film Processing