Publication | Open Access

Study on copper protrusion of through-silicon via in a 3-D integrated circuit

3D Ic ArchitectureElectrical EngineeringPhysical Design (Electronics)EngineeringAdvanced Packaging (Semiconductors)Applied PhysicsCopper Protrusion3D IntegrationSemiconductor Device FabricationElectronic PackagingMicroelectronics3D PrintingInterconnect (Integrated Circuits)3-D Integrated Circuit