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Cu:NiO as a hole-selective back contact to improve the photoelectrochemical performance of CuBi<sub>2</sub>O<sub>4</sub> thin film photocathodes

110

Citations

46

References

2019

Year

Abstract

Cu doped NiO (Cu:NiO) back contact layers are inserted between FTO substrates and CuBi<sub>2</sub>O<sub>4</sub> thin films to improve the performance of CuBi<sub>2</sub>O<sub>4</sub> photocathodes.

References

YearCitations

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